Underfill Process on Flip Chips Flip chip (FC) technology is a packaging method in which the chip is directly attached to the substrate, which has the advantages of high density, high performance and low cost. However, due to the coefficient of thermal expansion (CTE) mismatch between the chip and the substrate, the solder joints are subjected to large thermal stresses when the temperature changes, leading to fatigue damage and failure. To improve the reliability of solder joints, a common method is to i...

UNDERFILL FOR HIGH DENSITY INTERCONNECT FLIP CHIPS

Selective underfill for flip chips and flip-chip assemblies

No-flow underfill materials for flip chips

Automatisierte Bestückung und Underfill von Ultra-Fine-Pitch Flip-Chips

Automatisierte Bestückung und Underfill von Ultra-Fine-Pitch Flip-Chips

Flip chip underfill process

UNDERFILL PROCESS FOR FLIP-CHIP LEDS

Underfill process for flip-chip device

Three-Dimensional Cae Analysis Of Underfill Flow Of Flip-Chips